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speed2000
■原廠連結
■SPEED2000
詳細說明
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隨著電子元件邁向高速GHz及高密度構裝，High-Speed
PCB與IC Packages的設計面臨挑戰，Signal & Power Integrity ( SI/PI )
電性模擬逐漸成為高速數位電路正確運作的基礎。準確的SI/PI電性模擬必須針對整體的電子構裝做電磁場分析，傳統以TransmissionLine為主的SI
Simulation軟體，不能分析Power Distribution System，沒有考慮Power & Ground
Bounce (SSN) 效應，無法有效防治EMI，面對高速電路的挑戰，逐漸無能為力。
SPEED2000為當前針對High-Speed
PCB最完整之SI/PI模擬工具，擁有多項技術專利，將
Transmission Line Solver，Circuit
Solver及EM Field Solver，三者整合為一，完全考量整體構裝
之電磁場綜合效應：
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◆power & ground bounce
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◆reflection from edges of planes
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◆resonance inside the packages
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◆coupling between vias
and traces
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◆interaction between circuits and
packaging structures
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SPEED2000之突破性模擬技術，能準確分析power and ground distribution system，有效評估
decoupling capacitor設置及signal current return path discontinuities 效應。
SPEED2000目前廣為世界大廠採用！
INTEL, IBM, AMD, LSI, COMPAQ, HP, CISCO, NOKIA, NORTEL, NEC, HITACH … etc.
SPEED2000
開創
High-Speed PCB Simulation 的新格局！
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SPEED2000
is a signal, power and ground integrity tool
for electrical simulation of electronic IC package
& PCB.
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SPEED2000 combines integrated circuit and transmission
line simulation with a fast, special-purpose electromagnetic
field solver that computes dynamic electromagnetic
interactions within IC package & PCB. |
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The EM field solver of SPEED2000 takes into account power & ground
bounce ( SSN ), EM coupling between vias, reflection
from edges, resonance, and interactions between circuits and packages
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SPEED2000
歷經世界知名大廠之廣泛驗證
SPEED2000 is being used by worldwide leading companies, as well as high-tech
start-ups in computer,
networking and other high-speed electronic industries. One of the success stories of our customers is
from IBM -----
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